Kin-Shiung Chang

Title: Kin-Shiung Chang: Innovator in Electronic Packaging

Introduction

Kin-Shiung Chang is a notable inventor based in Meriden, CT (US). He has made significant contributions to the field of electronic packaging, holding a total of 5 patents. His work focuses on innovative processes that enhance the assembly and functionality of electronic components.

Latest Patents

Chang's latest patents include a process for the assembly of pin grid array electronic packages by vacuum lamination. This process involves applying a vacuum to the package components while bonding them with a dielectric sealant. The improved flow of the sealant into holes formed in the package base enhances the electrical isolation of terminal pins. Another notable patent is for the manufacturing of plastic pin grid arrays, which features an array of terminal pins that pass through apertures in an interconnect tape. The terminal pins are electrically connected to circuit traces, either through mechanical cinching or soldering. In one embodiment, the interconnect tape, terminal pins, and a heat sink are embedded in a molding polymer resin.

Career Highlights

Chang is currently associated with Olin Corporation, where he applies his expertise in electronic packaging. His innovative approaches have contributed to advancements in the industry, making him a valuable asset to his company.

Collaborations

Some of his notable coworkers include Thomas A. Armer and William G. Bridges, who have collaborated with him on various projects.

Conclusion

Kin-Shiung Chang's contributions to electronic packaging through his patents and work at Olin Corporation highlight his role as an influential inventor in the field. His innovative processes continue to shape the future of electronic component assembly.