Akashi, Japan

Kim Dong Hyun


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Innovator Profile: Kim Dong Hyun

Introduction

Kim Dong Hyun is a notable inventor based in Akashi, Japan. With a keen focus on advancements in plating technology, he has made a significant impact in the field through his innovative patent. His work emphasizes the importance of efficiency and effectiveness in electroless plating processes, contributing valuable solutions to the technology sector.

Latest Patents

Kim Dong Hyun holds a patent titled "Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method." This patent introduces a pretreatment solution that comprises a silver colloidal solution with essential components that optimize electroless plating. The solution includes silver colloidal particles, various metal ions, and ions that enhance the plating process. By utilizing this innovative approach, an effective catalyst for electroless plating is achieved, ensuring high-quality results in the final plated objects.

Career Highlights

Throughout his career, Kim has been associated with Daiwa Fine Chemicals Co., Ltd., where he has dedicated his expertise to developing new chemical solutions applicable in various industries. His work is characterized by a commitment to creating efficient and environmentally friendly technologies that cater to modern manufacturing needs.

Collaborations

In his professional journey, Kim Dong Hyun has collaborated with esteemed colleagues such as Yoshiaki Okuhama and Keigo Obata. These collaborations have allowed for a fruitful exchange of ideas and have further advanced the research and development in the field of electroless plating.

Conclusion

Kim Dong Hyun represents the spirit of innovation within the field of plating technology. His contributions through patents and collaborations showcase the potential for ongoing advancements in this area. As he continues to work with Daiwa Fine Chemicals Co., Ltd., his future endeavors are likely to lead to even more significant breakthroughs in electroless plating solutions.

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