The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2007
Filed:
Aug. 07, 2003
Yoshiaki Okuhama, Akashi, JP;
Keigo Obata, Akashi, JP;
Masakazu Yoshimoto, Akashi, JP;
Kim Dong Hyun, Akashi, JP;
Shingo Kitamura, Akashi, JP;
Seiichiro Nakao, Kobe, JP;
Hidenori Tsuji, Fujisawa, JP;
Hidemi Nawafune, Takatsuki, JP;
Yoshiaki Okuhama, Akashi, JP;
Keigo Obata, Akashi, JP;
Masakazu Yoshimoto, Akashi, JP;
Kim Dong Hyun, Akashi, JP;
Shingo Kitamura, Akashi, JP;
Seiichiro Nakao, Kobe, JP;
Hidenori Tsuji, Fujisawa, JP;
Hidemi Nawafune, Takatsuki, JP;
Daiwa Fine Chemicals Co., Ltd., Hyogo-ken, JP;
Abstract
A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.