Suwon, South Korea

Kibong Roh

This inventor holds 2 USPTO granted patents. Top assignees: Samsung Electronics Ltd., Nextid Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kibong Roh. Retrieved from https://idiyas.com/inventor/kibong-roh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Kibong Roh - Innovator in Container Packaging and Semiconductor Transport

Introduction

Kibong Roh is an inventor based in Suwon-si, South Korea. He has made significant contributions to the fields of container packaging and semiconductor transport. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

Kibong Roh's recent patent applications include the following:

1. **Apparatus for Packing Container and Method of Packing Container** - This application describes a container packaging apparatus that features a moving table to support a container, a bag supply unit for providing a vinyl bag, and a thermosetting unit to seal the vinyl bag. The design aims to enhance the efficiency of container packaging processes.

2. **Semiconductor Transport System and Method of Transporting Semiconductor** - This application outlines a method for transporting semiconductors, which involves using an accommodation container filled with nitrogen gas. The process includes multiple packaging steps and maintaining specific temperature and humidity conditions to ensure the integrity of the semiconductor during transport.

Conclusion

Kibong Roh's innovative approaches in container packaging and semiconductor transport demonstrate his commitment to advancing technology in these fields. His latest patent applications reflect his potential to contribute significantly to future developments.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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