Company Filing History:
Years Active: 2021
Title: Kian Soo Lim - Innovator in Semiconductor Packaging
Introduction
Kian Soo Lim is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. With a focus on developing reliable semiconductor packages, Lim has made significant strides in enhancing the efficiency and effectiveness of semiconductor technologies.
Latest Patents
Kian Soo Lim holds a patent for a method of forming a semiconductor package. This innovative method involves providing a package substrate with top and bottom major surfaces, where a die is attached to the die attach region. The process includes applying a cover adhesive and attaching a protective cover that enhances adhesion through a unique discontinuity on its side surfaces. This design ensures that the encapsulant effectively covers the exposed portions of the package while leaving the first major cover surface accessible. Lim's patent is a testament to his expertise in creating advanced semiconductor solutions, with a total of 1 patent to his name.
Career Highlights
Kian Soo Lim is currently employed at Utac Headquarters Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has contributed to the development of more reliable and efficient semiconductor packages, which are crucial for various electronic applications.
Collaborations
Throughout his career, Lim has collaborated with esteemed colleagues such as Hua Hong Tan and Chee Kay Chow. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the semiconductor field.
Conclusion
Kian Soo Lim's contributions to semiconductor packaging exemplify his commitment to innovation and excellence. His patent and ongoing work at Utac Headquarters Pte. Ltd. highlight his role as a key player in advancing semiconductor technology.