Irvine, CA, United States of America

Ki Wook Lee

USPTO Granted Patents = 4 

Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024-2025

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4 patents (USPTO):

Title: The Innovations of Ki Wook Lee

Introduction

Ki Wook Lee is a prominent inventor based in Irvine, California. He has made significant contributions to the field of electronic packaging and printed circuit board technology. With a total of four patents to his name, Lee continues to push the boundaries of innovation in his industry.

Latest Patents

One of Ki Wook Lee's latest patents is for an electronic package and method for manufacturing an electronic package. This invention provides a substrate designed to receive one or more electronic components, featuring a first electronic component mounted to one side of the substrate. The design includes a first mold structure that extends over part of the substrate, encapsulating a group of through-mold connections made of non-reflowable electrically conductive material. This innovative electronic package is also applicable in electronic devices. Another notable patent is for a closed-cavity printed circuit board. This method involves forming a cavity in a core structure, laminating the surfaces with adhesive and metal layers, and creating vias through the laminate structure. This advancement enhances the functionality and reliability of printed circuit boards.

Career Highlights

Ki Wook Lee is currently employed at Skyworks Solutions, Inc., where he applies his expertise in electronic packaging and circuit board technology. His work has been instrumental in developing cutting-edge solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Lee has collaborated with notable colleagues, including Anthony James Lobianco and Howard E Chen. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ki Wook Lee's contributions to the field of electronics through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the development of advanced electronic packaging and circuit board technologies.

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