Company Filing History:
1 out of 832,891 Years Active: 2007
Title: The Innovations of Ki Bon Cha
Introduction
Ki Bon Cha is an accomplished inventor based in Shinbong dong, Heungduk-ku, Cheongju-shi, Chungcheongbuk-Do, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through his innovative designs and methods.
Latest Patents
Ki Bon Cha holds a patent for a stack package and a fabricating method thereof. This invention utilizes a ball grid array semiconductor package, commonly referred to as 'BGA PKG'. The stack package allows for easy electrical connections between stacked BGA PKGs by simplifying the stack structure. Additionally, it enhances bonding reliability by improving the bonding force of solder balls on the substrates.
Career Highlights
Throughout his career, Ki Bon Cha has demonstrated a commitment to advancing technology in semiconductor packaging. His innovative approach has led to the development of solutions that address common challenges in the industry.
Collaborations
Ki Bon Cha has worked alongside his coworker, Dong You Kim, contributing to the development of cutting-edge technologies in their field.
Conclusion
Ki Bon Cha's contributions to semiconductor packaging through his patent reflect his dedication to innovation and technology. His work continues to influence the industry and pave the way for future advancements.