The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2007
Filed:
Dec. 29, 2003
Applicants:
Ki Bon Cha, Shinbong dong, Heungduk-ku, Cheongju-shi, Chungcheongbuk-Do, KR;
Dong You Kim, Sangdangku, Cheongju-shi, Chungcheongbuk-Do, KR;
Inventors:
Ki Bon Cha, Shinbong dong, Heungduk-ku, Cheongju-shi, Chungcheongbuk-Do, KR;
Dong You Kim, Sangdangku, Cheongju-shi, Chungcheongbuk-Do, KR;
Assignee:
Other;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/58 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed are a stack package and a fabricating method thereof using a ball grid array semiconductor package (hereinafter, referred to as 'BGA PKG'). The stack package can easily electrically connect the stacked BGA PKGs with each other by simplifying a stack structure between the BGA PKGs, and increase bonding reliability by improving bonding force bonded portions of solder balls of substrates.