Kevin The-Hung Pham

Title: Kevin The-Hung Pham: Innovator in Soldering Technology

Introduction

Kevin The-Hung Pham is an accomplished inventor based in Seattle, Washington. He has made significant contributions to the field of electronics through his innovative patent related to soldering printed circuits. His work exemplifies the intersection of technology and practical application in electronic device manufacturing.

Latest Patents

Kevin holds a patent for a method of soldering printed circuits using radiant heat. This patent outlines a process for forming solder joints between printed circuits by utilizing radiant heat. One notable example from his patent describes a method that involves aligning a contact of a first printed circuit with a via of a second printed circuit. The method further details the application of radiant heat via an infrared light source to a second surface of the second printed circuit. This radiant heat is directed at the via, causing it to conduct heat to the solder located at the interface of the contact and the via. After heating the solder to reflow, the solder is cooled, resulting in a solid solder joint between the two printed circuits.

Career Highlights

Kevin is currently employed at Microsoft Technology Licensing, LLC, where he continues to innovate and contribute to advancements in technology. His work at Microsoft has allowed him to explore new methodologies and improve existing processes in electronic manufacturing.

Collaborations

Kevin has collaborated with notable colleagues such as David Christopher Perna and Elisa Naseem Haqq. These collaborations have fostered an environment of innovation and creativity, leading to advancements in their respective fields.

Conclusion

Kevin The-Hung Pham is a notable inventor whose work in soldering technology has made a significant impact on electronic device manufacturing. His innovative approach and dedication to his craft continue to inspire advancements in the industry.