This inventor holds 1 USPTO granted patent and 3 published patent applications and 1 EPO patent. Top assignee: Honeywell International Inc.. Active years: 2016.
Company Filing History:
Years Active: 2016
Title: Kevin B. Albaugh: Innovator in Electronics Packaging
Introduction
Kevin B. Albaugh is a notable inventor based in Liberty Lake, WA (US). He has made significant contributions to the field of electronics packaging, particularly through his innovative designs and methods.
Latest Patents
Kevin holds a patent for a "Lead frame construct for lead-free solder connections." This invention involves an electronics packaging arrangement that utilizes a lead frame construct designed for lead-free solder connections. The lead frame, typically made of copper, features a metallic barrier layer of nickel to prevent oxidation. A thin wetting promoting layer of copper is applied to enhance the uniform wetting of lead-free, zinc-based solder during the die connect process. The invention ensures that a copper/zinc intermetallic layer is formed, which is thin enough to resist internal cracking during manufacturing and use.
Career Highlights
Kevin is currently employed at Honeywell International Inc., where he continues to innovate in the field of electronics. His work has been instrumental in advancing technologies that rely on reliable solder connections in electronic devices.
Collaborations
Throughout his career, Kevin has collaborated with talented individuals such as Jianxing Li and David E. Steele. These partnerships have contributed to the development of cutting-edge technologies in electronics packaging.
Conclusion
Kevin B. Albaugh's contributions to electronics packaging through his innovative patent demonstrate his commitment to advancing technology in this field. His work at Honeywell International Inc. and collaborations with other professionals highlight his role as a key inventor in the industry.