Keunho Rhew

Title: Keunho Rhew: Innovator in Semiconductor Technology

Introduction

Keunho Rhew is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and patents. His work is instrumental in advancing the capabilities of semiconductor packages.

Latest Patents

Keunho Rhew holds a patent for a semiconductor package that includes a stacked chip structure. This patent describes a semiconductor package that features a package substrate with an upper surface containing a bonding pad. The design includes a lower semiconductor chip positioned on the upper surface of the package substrate. The lower semiconductor chip has a connect edge region with a connection pad and an open edge region that incorporates a dam structure with dummy bumps. Additionally, a bonding wire connects the bonding pad and the connection pad, while an upper semiconductor chip is placed on the lower semiconductor chip using an inter-chip bonding layer. The entire assembly is surrounded by a molding portion on the package substrate.

Career Highlights

Keunho Rhew is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to be at the forefront of semiconductor innovation. He has developed technologies that enhance the performance and efficiency of semiconductor packages.

Collaborations

Throughout his career, Keunho Rhew has collaborated with notable colleagues, including Hyunggyun Noh and Sangwoo Pae. These collaborations have contributed to the development of advanced semiconductor technologies and have fostered a culture of innovation within their team.

Conclusion

Keunho Rhew's contributions to semiconductor technology through his patent and work at Samsung Electronics Co., Ltd. highlight his role as an influential inventor in the field. His innovative designs continue to shape the future of semiconductor packaging.