Hadano, Japan

Kenzo Endo

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi, Ltd.. Active years: 1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenzo Endo. Retrieved from https://idiyas.com/inventor/kenzo-endo-9wo3z9x7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: Kenzo Endo: Innovator in Printed Circuit Board Technology

Introduction

Kenzo Endo is a notable inventor based in Hadano, Japan. He has made significant contributions to the field of printed circuit board technology. His innovative work focuses on methods for detecting through-hole voids in multi-layer printed circuit boards.

Latest Patents

Kenzo Endo holds 1 patent for a method and apparatus designed to detect through-hole voids in multi-layer printed circuit boards. This invention involves illuminating a through-hole formed with an electrical conductor using a beam of a specific wavelength. The method allows for the detection of voids by exciting a luminescent beam from the layer material, which is then converted into an electrical signal by a photoelectric converter. The presence of a void is indicated by this electrical signal, enhancing the reliability of printed circuit boards.

Career Highlights

Kenzo Endo is associated with Hitachi, Ltd., a leading company in technology and innovation. His work at Hitachi has allowed him to develop and refine his inventions, contributing to advancements in electronic manufacturing processes.

Collaborations

Kenzo Endo has collaborated with Yasuhiko Hara, a fellow innovator in the field. Their partnership has likely fostered the exchange of ideas and expertise, further enhancing their contributions to technology.

Conclusion

Kenzo Endo's innovative approach to detecting through-hole voids in printed circuit boards exemplifies the importance of advancements in electronic manufacturing. His contributions continue to influence the industry and improve the reliability of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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