This inventor holds 2 USPTO granted patents. Top assignee: Hitachi, Ltd.. Active years: 1995-1999.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1995-1999
Title: Kenzi Kikuta: Innovator in Printed Wiring Board Technology
Introduction
Kenzi Kikuta is a notable inventor based in Hadano, Japan. He has made significant contributions to the field of printed wiring board technology. With a focus on environmentally friendly processes, Kikuta has developed innovative methods that simplify production steps while eliminating harmful solvents.
Latest Patents
Kenzi Kikuta holds 2 patents related to the production of printed wiring boards. His latest patents include a process that utilizes a developer comprising a chlorine-free organic solvent and an alkaline aqueous solution. This method employs a resist material made from a copolymer of methacrylic acid and methyl methacrylate. The innovation allows for simplified production steps, even when using large-area substrates, and facilitates the abolishment of chlorine-containing organic solvents.
Career Highlights
Kikuta is currently associated with Hitachi, Ltd., where he continues to advance his research and development efforts. His work has been instrumental in enhancing the efficiency and sustainability of printed wiring board manufacturing.
Collaborations
Kikuta has collaborated with notable colleagues, including Haruo Akahoshi and Toshiaki Ishimaru. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Kenzi Kikuta's innovative approaches to printed wiring board technology exemplify his commitment to sustainability and efficiency in manufacturing. His contributions are paving the way for advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
