Osaka, Japan

Kento Ishihara

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Osaka University. Active years: 2020.

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Kento Ishihara: Innovator in Surface-Modified Molded Articles

Introduction

Kento Ishihara is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in the development of processes for producing surface-modified molded articles. His innovative work aims to enhance the performance and bonding capabilities of molded articles containing organic polymer compounds.

Latest Patents

Kento Ishihara holds a patent for a process titled "Process for producing surface-modified molded article, and process for producing composite using surface-modified molded article." The objective of this invention is to provide a method that enhances the surface layer strength of molded articles. This process allows for the bonding of molded articles, such as those made from fluororesin, to adherends without the need for adhesives. Additionally, it simplifies the treatment steps and apparatus involved in atmospheric-pressure plasma treatment.

Career Highlights

Ishihara is affiliated with Osaka University, where he continues to advance research in material sciences. His work has garnered attention for its practical applications in various industries, particularly those that utilize molded articles with low adhesive properties.

Collaborations

Kento Ishihara has collaborated with esteemed colleagues, including Masafumi Shibahara and Kazuya Yamamura. These partnerships have contributed to the development and refinement of his innovative processes.

Conclusion

Kento Ishihara's contributions to the field of surface-modified molded articles demonstrate his commitment to innovation and practical solutions in materials science. His patent reflects a significant advancement in the bonding capabilities of organic polymer compounds, showcasing the potential for future applications in various industries.

Profile summary based on public USPTO records.
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