Soja, Japan

Kentaro Yabuki


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Kentaro Yabuki: Innovator in Resin Composition Technology

Introduction

Kentaro Yabuki is a notable inventor based in Soja, Japan. He has made significant contributions to the field of resin compositions, particularly in applications related to prepregs and semiconductor packages. His innovative work has led to the development of technologies that enhance the flexibility and workability of resin materials.

Latest Patents

Kentaro Yabuki holds a patent for a resin composition, prepreg, laminate, and semiconductor package. This invention provides a resin composition that can form a prepreg with sufficient flexibility to prevent cracking. The composition includes a first thermosetting resin, a second thermosetting resin with a lower weight average molecular weight, a curing agent, and a filler. The prepreg is created by impregnating a base sheet material with this resin composition. The laminate is formed by laminating a metallic foil on the prepreg and molding them under heat and pressure. This technology is crucial for manufacturing semiconductor packages by mounting IC chips on the prepreg.

Career Highlights

Kentaro Yabuki is associated with Sumitomo Bakelite Company Limited, where he has been instrumental in advancing resin technology. His work has not only contributed to the company's portfolio but has also positioned it as a leader in innovative materials for electronics.

Collaborations

Kentaro has collaborated with notable colleagues, including Takeshi Hosomi and Masako Yamashita. Their combined expertise has fostered a productive environment for innovation and development within the company.

Conclusion

Kentaro Yabuki's contributions to resin composition technology exemplify the impact of innovative thinking in the field of materials science. His patent reflects a commitment to enhancing the performance and reliability of semiconductor packages, showcasing the importance of flexibility and workability in modern applications.

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