This inventor holds 2 USPTO granted patents, plus 1 CIPO patent. Top assignees: Sanwa Kagaku Kenkyusho Co., Ltd., Kikusui Seisakusho Ltd.. Active years: 2010-2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2010-2018
Title: Kentaro Izumi: Innovator in Powder Filling and Molding Technologies
Introduction
Kentaro Izumi is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of manufacturing, particularly in the development of devices and methods for powder filling and molding processes. With a total of two patents to his name, Izumi's work showcases his innovative approach to solving complex engineering challenges.
Latest Patents
Izumi's latest patents include a "Powder Filling Device with Redundant Powder Collection Mechanism" and a "Method of Manufacturing a Molding with a Core." The powder filling device is designed to actively recover and reuse excess powdery material, even during the production of multi-layer tablets. This innovation enhances efficiency in manufacturing processes. The method for manufacturing a molding with a core utilizes double-structured punches to improve the strength of the outer layer of the molding, allowing for a more robust final product.
Career Highlights
Throughout his career, Kentaro Izumi has worked with reputable companies such as Sanwa Kagaku Kenkyusho Co., Ltd. and Kikusui Seisakusho Ltd. His experience in these organizations has contributed to his expertise in the field of manufacturing technologies.
Collaborations
Izumi has collaborated with notable coworkers, including Yuichi Ozeki and Katsuhito Fujisaki. These partnerships have likely fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Kentaro Izumi's contributions to the field of manufacturing through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry, paving the way for advancements in powder filling and molding technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile