Kenta Kuroda

Title: Kenta Kuroda: Solid-State Imaging Package Innovation.

Introduction

Kenta Kuroda is an inventor associated with Osaka, Japan, and Kaneka Corporation. His patent work concerns the packaging and manufacture of solid-state imaging devices.

Latest Patents

The provided information lists one patent for Kuroda: “Solid-state imaging device package manufacturing method and solid-state imaging device package.” The invention describes a package with an imaging device, a surrounding frame, and a transparent substrate positioned over the device’s functional imaging portion. Its manufacturing method uses a 3D printer to build the frame by layering resin on either the imaging device or the transparent substrate, then bonds the other component to the frame. The method specifies an inner frame surface roughness, Ra, of 50 nanometers to 30 micrometers. Kuroda is credited with 1 patent.

Career Highlights

Kuroda’s listed patent reflects work on applying 3D printing to solid-state imaging device packaging. The approach focuses on forming the frame and controlling its inner surface roughness as part of the manufacturing process. The provided information identifies Kaneka Corporation as his company.

Collaborations

Daiki Kinoshita is identified as Kuroda’s coworker. The available information does not specify their roles in the patent or describe any particular collaboration.

Conclusion

Kenta Kuroda’s listed invention combines 3D-printed resin framing with a transparent substrate to create a solid-state imaging device package.