Aso, Japan

Kenta Kohatsu

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Nok Corporation. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenta Kohatsu. Retrieved from https://idiyas.com/inventor/kenta-kohatsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Kenta Kohatsu: Inventor of a Compact Mold for Gasket Manufacturing.

Introduction

Kenta Kohatsu is an inventor based in Aso, Japan, and is associated with NOK Corporation. His work includes an invention concerning the molding and manufacture of gaskets.

Latest Patents

Kohatsu is credited with 1 patent: “Mold for Gasket, Method for Manufacturing the Gasket, and Gasket.” The invention describes a mold for integrally forming an endless gasket. Its molding grooves are arranged in parallel spiral paths, with reversing sections at their inner ends and connected outer ends. This configuration is intended to reduce the mold’s planar footprint, helping limit the size of manufacturing equipment. Integral molding also avoids the labor and time involved in joining separate gasket sections and helps prevent weakness at a connection point.

Career Highlights

Kohatsu’s listed patent reflects an engineering focus on improving gasket production through compact tooling and integral molding. The available information identifies NOK Corporation as his company.

Collaborations

Daihachi Shojima and Kazuyuki Asai are identified as Kohatsu’s coworkers. The available details do not specify their roles in the gasket-related patent.

Conclusion

Kenta Kohatsu’s patent addresses practical manufacturing challenges by combining a compact mold layout with integral gasket molding, with the aim of improving production efficiency and avoiding a weak joint.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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