Kyoto, Japan

Kenta Hosoi

This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: Panasonic Intellectual Property Management Co., Ltd.. Active years: 2019.

USPTO Granted Patents = 1 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Kenta Hosoi - Innovator in Heat Insulating Structures

Introduction

Kenta Hosoi is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of thermal insulation through his innovative designs and patents. His work focuses on enhancing the properties of heat insulating structures, making them more efficient and durable.

Latest Patents

Kenta Hosoi holds a patent for a heat insulating structure using aerogel. The objective of this invention is to propose a heat insulating structure that excels in thermal insulating properties while also being stronger. The structure comprises an aerogel layer that includes aerogel particles, adhesive, and fibers, along with a retainer that is provided to at least one face of the aerogel layer. This retainer consists of fiber materials and binder resin, with each fiber being part of one of the fiber materials included in the retainer. He has 1 patent to his name.

Career Highlights

Kenta Hosoi is associated with Panasonic Intellectual Property Management Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of heat insulation materials, contributing to various applications in the industry.

Collaborations

Kenta has collaborated with notable colleagues such as Hideyuki Ando and Kazuma Kugimiya. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Kenta Hosoi's contributions to the field of heat insulation demonstrate his commitment to innovation and excellence. His patent for a heat insulating structure using aerogel showcases his ability to combine strength and thermal efficiency in materials.

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