Kenny Y Ng

Title: Kenny Y. Ng and Semiconductor Thermal Measurement

Introduction

Kenny Y. Ng is an inventor associated with Union City, California, and VLSI Technology, Inc. His patent work addresses the measurement of thermal resistance in semiconductor packages, an important consideration in evaluating how effectively a package transfers heat.

Latest Patents

Ng is credited with 1 patent, titled “Technique for Measuring Thermal Resistance of Semiconductor Packages.” The invention describes a thermal test apparatus that uses a substrate shaped like a semiconductor die and placed in contact with packaging material. A heating source warms the substrate, while a temperature-sensitive element—such as a diode—provides a voltage drop that can be used to determine temperature.

The design uses separate conductive traces for forcing current through the element and sensing its forward voltage. By placing the sensing connections very close to the element, including within two microns in one described arrangement, the apparatus reduces measurement error caused by resistance in the traces. The resulting temperature measurement helps characterize the thermal properties of semiconductor designs and packaging materials.

Career Highlights

Ng’s documented patent contribution focuses on improving the accuracy of thermal measurements for semiconductor packages. The approach offers a way to assess heat-transfer characteristics while reducing errors associated with the measurement circuitry.

Collaborations

Ng’s listed coworker is Chin-Ching Huang. The patent is associated with VLSI Technology, Inc.

Conclusion

Kenny Y. Ng’s patent describes a practical method for measuring semiconductor package thermal resistance, with carefully positioned sensing connections designed to improve measurement accuracy.