Company Filing History:
Years Active: 2001
Title: The Innovative Contributions of Kenneth Patrick Reilich
Introduction
Kenneth Patrick Reilich is a notable inventor based in Ramona, California. He has made significant contributions to the field of integrated circuit packaging through his innovative patent. His work focuses on improving the recycling process of substrates from integrated circuit packages, showcasing his commitment to advancing technology in this area.
Latest Patents
Kenneth holds a patent for a "Process for recycling a substrate from an integrated circuit package." This innovative process involves several steps, including grinding, dissolving, and disintegrating. The grinding step effectively removes the IC-chip from the substrate while also grinding a portion of the filler layer and solder balls. Following this, the dissolving step eliminates the remaining filler layer, and the disintegration step uses ultrasonic vibration to break down the partial solder balls. This method leaves the substrate with small solder mounds, facilitating the attachment of another IC-chip.
Career Highlights
Kenneth is currently employed at Unisys Corporation, where he continues to apply his expertise in integrated circuit technology. His work at Unisys has allowed him to contribute to various projects that enhance the efficiency and sustainability of electronic components.
Collaborations
Throughout his career, Kenneth has collaborated with talented individuals such as Ronald Allen Norell and Elvira Widyani Preecha. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Kenneth Patrick Reilich's contributions to the field of integrated circuit packaging through his innovative recycling process highlight his dedication to advancing technology. His work not only improves the efficiency of electronic components but also promotes sustainability in the industry.