Kenneth M Wasko

Title: Innovations by Kenneth M Wasko

Introduction

Kenneth M Wasko is a notable inventor based in Boca Raton, FL (US). He has made significant contributions to the field of technology, particularly in the area of solder bump formation for infrastructure equipment. With a total of 5 patents to his name, Wasko's work has had a considerable impact on the industry.

Latest Patents

Among his latest patents is a method and apparatus for forming pre-positioned solder bumps on a pad arrangement of a substrate. This innovative process involves placing a predetermined pattern of solder preforms in contact with a meltable adhesive fluxing agent on a carrier tape. The fluxing agent is then heated to melt it, followed by cooling to resolidify, which secures the solder preforms to the carrier tape. The carrier tape is aligned over the pad arrangement, and the solder preforms are transferred to the pad arrangement by heating them to form the solder bumps in the predetermined pattern.

Career Highlights

Kenneth Wasko has had a distinguished career, working with Motorola Corporation, where he has been able to apply his inventive skills to develop cutting-edge technologies. His contributions have not only advanced the company's objectives but have also set new standards in the industry.

Collaborations

Throughout his career, Wasko has collaborated with talented individuals such as Frank J Juskey and Douglas W Hendricks. These partnerships have fostered an environment of innovation and creativity, leading to the successful development of various technologies.

Conclusion

Kenneth M Wasko's innovative work in the field of solder bump formation has established him as a prominent figure in technology. His patents and collaborations reflect his commitment to advancing the industry and contributing to significant technological advancements.