South Bend, IN, United States of America

Kenneth J Mroczkiewicz


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Kenneth J. Mroczkiewicz: Innovating Chip Installation Technologies

Introduction: Kenneth J. Mroczkiewicz, based in South Bend, Indiana, is a notable inventor in the field of integrated circuits. With a unique patent to his name, he has made significant contributions to enhancing the efficiency of chip installation processes. His dedication to innovation is exemplified by his work with integrated circuit technologies.

Latest Patents: Kenneth holds a patent for a "Socket for positioning and installing an integrated circuit chip." This innovative socket features terminals positioned on one side of the chip, allowing for effective installation on a conductive elastomer. The design includes a base that adequately positions the chip over the elastomer, along with a camming member that moves between an open position and a closed position. In the closed position, the camming member exerts a force on the chip, embedding the terminals into the elastomer, which establishes a robust electrical connection.

Career Highlights: Kenneth has made significant strides in his career at Wells-CTI, Inc., where he applies his expertise in integrated circuits. His work revolves around the development of technologies that improve the reliability and performance of electronic components, showcasing his commitment to advancing the field of electronics.

Collaborations: Throughout his career, Kenneth has worked closely with his coworker, Michael S. Glick. Their collaboration has been crucial in refining integrated circuit technologies and fostering innovation within their projects at Wells-CTI, Inc.

Conclusion: Kenneth J. Mroczkiewicz’s innovative patent and collaborative spirit underline his important role in the realm of integrated circuits. His contributions not only enhance current technologies but also pave the way for future advancements in chip installation techniques.

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