Kenneth G Maish

Title: Kenneth G Maish: Innovator in Microelectronic Packaging

Introduction

Kenneth G Maish is a notable inventor based in Tucson, AZ, recognized for his contributions to microelectronic packaging technology. He holds a patent that showcases his innovative approach to creating hermetically sealed microelectronic packages.

Latest Patents

Kenneth G Maish's patent focuses on using a thermal barrier to provide a hermetic seal surface on aluminum. This invention involves a hermetically sealed microelectronic package that utilizes a thermal barrier or interposer between a cover and an aluminum nitride substrate. The design includes a solder interface on the aluminum nitride substrate, with the thermal barrier positioned on the solder interface. The cover is attached to the solder interface using a solder seal, effectively creating a hermetically sealed package. This thermal barrier allows for low-cost, low-temperature soldering of metal covers to the metallized aluminum nitride substrate, making it compatible with volume production processing.

Career Highlights

Kenneth G Maish is associated with Raytheon Company, where he has made significant contributions to the field of microelectronics. His work has been instrumental in advancing the technology used in microelectronic packaging, enhancing the reliability and efficiency of electronic devices.

Collaborations

Throughout his career, Kenneth has collaborated with notable colleagues, including Gary A Dreyer and Alan L Kovacs. These collaborations have further enriched his work and contributed to the development of innovative solutions in the industry.

Conclusion

Kenneth G Maish's innovative patent and his role at Raytheon Company highlight his significant impact on microelectronic packaging technology. His work continues to influence advancements in the field, showcasing the importance of innovation in electronics.