Marietta, GA, United States of America

Kenneth C Smith

This inventor holds 1 USPTO granted patent and 1 published patent application, plus 2 CIPO patents. Top assignee: Westrock Packaging Systems, LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenneth C Smith. Retrieved from https://idiyas.com/inventor/kenneth-c-smith-hjvhf8kq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kenneth C. Smith: Packaging Innovation

Introduction

Kenneth C. Smith is an inventor based in Marietta, Georgia, with 1 patent. His work includes an article carrier and a blank for forming the carrier, developed in connection with WestRock Packaging Systems, LLC.

Latest Patents

Smith’s patent, “Article Carrier and Blank Therefor,” describes a package designed to bundle one or more articles. The carrier has a top panel and a surrounding skirt structure made of connected panels that form a continuous loop around a group of articles.

The design allows the skirt structure to change between a pre-loading form and a post-loading form. Once articles are received, the distance between the distal ends of opposing panels increases, allowing the carrier to accommodate and bundle the articles.

Career Highlights

Smith’s documented patent work focuses on packaging design. The article carrier’s adjustable structure addresses how a package can expand during loading while maintaining a continuous enclosure around the bundled articles.

Collaborations

Smith’s work is associated with WestRock Packaging Systems, LLC. His listed coworkers include Emma Wingerd and Jean-Michel Garnier.

Conclusion

Kenneth C. Smith’s patented article carrier reflects a practical packaging innovation, using a flexible panel structure to bundle articles and adapt to them during loading.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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