This inventor holds 1 USPTO granted patent. Top assignee: Matsushita Electric Industrial Co., Ltd.. Active years: 1994.
Company Filing History:
Years Active: 1994
Title: Kenji Ootomo: Innovator in Electronic Component Mounting
Introduction
Kenji Ootomo is a notable inventor based in Kadoma, Japan. He has made significant contributions to the field of electronics, particularly in the method of mounting electronic components on circuit boards. His innovative approach has paved the way for advancements in electronic manufacturing.
Latest Patents
Ootomo holds a patent for a method of mounting electronic components on a circuit board. This patent utilizes anisotropic conductive material instead of traditional solder for connecting the terminals of components to printed circuit boards. The method involves sandwiching the terminal of the component between anisotropic materials on both the printed circuit board and a printed circuit sheet. Heat and pressure are applied simultaneously to the terminal part, a process known as thermocompression bonding.
Career Highlights
Kenji Ootomo is associated with Matsushita Electric Industrial Co., Ltd., a leading company in the electronics industry. His work has contributed to the development of more efficient and reliable electronic devices. Ootomo's innovative techniques have been instrumental in enhancing the manufacturing processes within the company.
Collaborations
Throughout his career, Ootomo has collaborated with notable colleagues, including Yoshihito Okazaki and Kouji Tanabe. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Kenji Ootomo's contributions to the field of electronics, particularly through his patented methods, highlight his role as a significant inventor. His work continues to influence the industry and improve electronic component manufacturing processes.