Chiba, Japan

Kenji Nakajima

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Nippon Steel Chemical Co., Ltd.. Active years: 1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenji Nakajima. Retrieved from https://idiyas.com/inventor/kenji-nakajima-qklve337

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Kenji Nakajima

Introduction: Kenji Nakajima, an accomplished inventor based in Chiba, Japan, has made significant contributions to the field of materials science. With a focus on enhancing technology in printed circuit fabrication, his developments have paved the way for advancements in electronic manufacturing.

Latest Patents: Kenji holds one patent titled "Heat-resistant film adhesive for use in fabrication of printed circuits." This innovative adhesive is designed to withstand high temperatures, making it an essential component in the production of reliable and durable electronic devices.

Career Highlights: Kenji Nakajima's career is marked by his association with Nippon Steel Chemical Co., Ltd., where he applies his expertise to develop cutting-edge materials. His dedication to research has positioned him as a leading figure in the realm of heat-resistant materials in electronics.

Collaborations: Throughout his career, Kenji has worked alongside talented colleagues such as Fumihiro Ohmori and Yukihiro Wada. Their collaborative efforts have fostered an environment of innovation, enabling the team to push boundaries in the development of new materials.

Conclusion: Kenji Nakajima exemplifies the spirit of innovation, contributing valuable advancements in the field of printed circuit technology. With his patent for a heat-resistant film adhesive, he has established himself as a key inventor whose work will continue to impact the electronics industry for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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