Kenji Morinaga

Title: Kenji Morinaga: Innovator in Thick Film Circuit Technology

Introduction

Kenji Morinaga is a notable inventor based in Fukuoka, Japan. He has made significant contributions to the field of thick film circuit technology, holding a total of 2 patents. His work focuses on enhancing the performance and efficiency of substrates used in electronic applications.

Latest Patents

Morinaga's latest patents include innovative substrates designed for the fabrication of thick film circuits. The first patent describes a substrate that improves heat radiation capability without sacrificing affinity for a paste. This substrate features a multi-level structure with a foundation of aluminum nitride and a surface film made of an oxygen compound containing silicon atoms. The second patent also pertains to an insulating substrate for thick film circuits, which includes a foundation of aluminum nitride. This substrate incorporates an oxidizing agent, such as yttrium oxide or calcium oxide, to enhance the stiffness of the foundation. The surface film structure is designed to improve resistivity against firing operations.

Career Highlights

Throughout his career, Kenji Morinaga has worked with prominent companies, including Mitsubishi Metal Corporation and Mitsubishi Materials Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in thick film circuit technology.

Collaborations

Morinaga has collaborated with notable colleagues in his field, including Hideaki Yoshida and Hiroto Uchida. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Kenji Morinaga's contributions to thick film circuit technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and their applications in electronics. His work continues to influence the industry and pave the way for future advancements.