Kariya-city, Japan

Kenichi Takeshima

This inventor holds 1 USPTO granted patent. Top assignee: Denso Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenichi Takeshima. Retrieved from https://idiyas.com/inventor/kenichi-takeshima-r8wsz0ef

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kenichi Takeshima: Circuit Board Innovation

Introduction

Kenichi Takeshima is an inventor associated with Denso Corporation in Kariya-city, Japan. His patent work includes a circuit-board design that integrates a high-magnetic-permeability film into a printed board.

Latest Patents

Takeshima is credited with 1 patent. His patent, “Circuit board and printed board,” describes a printed board with an insulating base and layered conductors, including a signal line connected to an electronic component and a potential-fixed layer set to a predetermined electrical potential. A high-magnetic-permeability film is placed on the potential-fixed layer’s surface, positioned to overlap the signal line through the board’s thickness. The design addresses the arrangement of magnetic material and signal conductors within a circuit board.

Career Highlights

Takeshima’s listed patent reflects work on printed-board structure and the placement of magnetic materials relative to signal lines. He is associated with Denso Corporation, an automotive technology company based in Japan.

Collaborations

The provided information lists Eriko Yazu and Ryosuke Omura as Takeshima’s coworkers. Their specific roles in the patent or related development work are not stated.

Conclusion

Kenichi Takeshima’s patent documents a circuit-board design that combines layered conductors with a strategically positioned high-magnetic-permeability film.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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