Utsunomiya, Japan

Kenichi Takase

This inventor holds 4 USPTO granted patents and 1 published patent application, plus 1 CIPO patent and 2 EPO patents. Top assignee: Jsp Corporation. Active years: 2010-2013.

USPTO Granted Patents = 4 

% Patents Active = 100.0



Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 28(Granted Patents)


Location History:

  • Kanuma, JP (2010)
  • Utsunomiya, JP (2011 - 2013)

Company Filing History:


Years Active: 2010-2013

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4 patents (USPTO):Explore Patents

Title: Kenichi Takase: Innovator in Foam Molding Technology

Introduction

Kenichi Takase is a prominent inventor based in Utsunomiya, Japan. He has made significant contributions to the field of foam molding technology, holding a total of 4 patents. His innovative approaches have led to advancements in the production of lightweight and durable materials.

Latest Patents

One of Kenichi Takase's latest patents is a method of forming hollow foam moldings. This method involves producing a hollow foam molding with a thin and uniform wall thickness by extruding a foamable melt containing a polypropylene resin. The process includes placing the parison in a mold and blowing gas into it to achieve a hollow foam molding with a hardened polypropylene resin foam layer. Another notable patent is for a multi-layered polylactic acid resin foamed body. This invention aims to provide a foamed body with excellent mechanical strength and heat resistance, featuring a laminate structure that enhances its overall performance.

Career Highlights

Kenichi Takase is associated with Jsp Corporation, where he continues to innovate in the field of materials science. His work has been instrumental in developing products that meet the demands of modern applications, particularly in industries requiring lightweight and strong materials.

Collaborations

Throughout his career, Kenichi has collaborated with notable colleagues, including Masayasu Okuda and Masato Naito. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Kenichi Takase's contributions to foam molding technology exemplify the spirit of innovation. His patents reflect a commitment to enhancing material properties and performance, making a lasting impact in his field.

Profile summary based on public USPTO records.
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