This inventor holds 3 USPTO granted patents. Top assignee: Matsushita Electric Industrial Co., Ltd.. Active years: 1998-2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1998-2003
Title: Kenichi Otake: Innovator in Bonding Technology
Introduction
Kenichi Otake is a notable inventor based in Fukuoka, Japan. He has made significant contributions to the field of bonding technology, particularly through his innovative designs and patents. With a total of 3 patents to his name, Otake continues to push the boundaries of engineering and technology.
Latest Patents
Otake's latest patents include a bonding apparatus and bonding tool for components. This invention features a bonding tool that bonds a component to a substrate through urging and vibration. A through hole is formed in the horn, where an adhesion section fits into the lower section of the hole, and an engaging section fits into the upper section. This design creates a sealed inner space inside the hole by tightening an outer screw. An adhesion hole, which opens to a bonding section, communicates with a sucking hole of the horn via the inner space. This results in a simply structured vacuum-adhesion system that maintains the replaceability of the adhesion section, which is detachable from the horn. Consequently, the adhesion section can be replaced as an independent part, enhancing the functionality of the bonding apparatus and tool.
Career Highlights
Kenichi Otake is currently employed at Matsushita Electric Industrial Co., Ltd. His work at this esteemed company has allowed him to develop and refine his innovative bonding technologies. His contributions have been instrumental in advancing the capabilities of bonding tools used in various applications.
Collaborations
Otake has collaborated with notable coworkers, including Seiji Takahashi and Takatoshi Ishikawa. Their combined expertise has fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Kenichi Otake is a distinguished inventor whose work in bonding technology has led to significant advancements in the field. His innovative patents and collaborations with talented colleagues continue to shape the future of bonding apparatuses and tools.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile