Company Filing History:
Years Active: 2005-2014
Title: Kenichi Miura: Innovator in Foam Technology
Introduction
Kenichi Miura is a notable inventor based in Inazawa, Japan. He has made significant contributions to the field of foam technology, holding a total of 2 patents. His innovative designs focus on enhancing the functionality and efficiency of foam fillers and void filling devices.
Latest Patents
Miura's latest patents include a Foam Filler and a Void Filling Device. The Foam Filler is designed with a base that forms foam and is placed inside a hollow structure with a through hole. It features an opening larger than the through hole, allowing for effective thermal expansion and flow management. The upper wall of the foam filler adapts to the base's movement during heating, preventing the base from entering the through hole. The Void Filling Device facilitates the insertion of a void filling material into tubular components. It includes a holder that retains the void filling material, which expands with heat and is made from a different material to allow for elastic deformation.
Career Highlights
Kenichi Miura is associated with Iida Industry Co., Ltd., where he applies his expertise in foam technology. His work has led to advancements in products that require effective void filling solutions.
Collaborations
Miura collaborates with talented coworkers, including Koichiro Ohbai and Koji Tokuyama, who contribute to the innovative environment at Iida Industry Co., Ltd.
Conclusion
Kenichi Miura's contributions to foam technology through his patents demonstrate his commitment to innovation and problem-solving in the industry. His work continues to influence advancements in the field, showcasing the importance of creativity in engineering.