Iida Industry Co., Ltd.

Kenichi Miura

Koichiro Ohbai

Koji Tokuyama

Akira Yamada

A foam filler is provided with a base for forming a foam and placed inside a hollow structure having a through hole. An opening having an area larger than the opening of the through hole is created in the base and surrounding the through hole. The foam filler is provided with an upper wall which follows the flow and the thermal expansion of the base at the time of heating. The upper wall closes at least part of the opening of the through hole when following the flow and the thermal expansion of the base, and thus prevents the base from entering into the through hole. The upper wall is provided in a peripheral portion of the opening and placed in a part of an area surrounding the through hole.

Foam filler and hollow structure

A void filling device which facilitates insertion of a void filling material into a tubular component and hold of the void filling material therewithin. The device comprises a holder for void filling material which is designed to retain the void filling material to fill a void space by expanding with heat and is of a different material from the void filling material so as to be elastically deformed and inserted into the void space. When the cross-sectional configuration of the void space of the tubular component is a rectangle, the holder is formed into a plate-like configuration which is longer than the diagonal line of the rectangle and is adapted to be insertable into the void space by bending the same arcuately.

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Inazawa, Japan

Kenichi Miura