Company Filing History:
Years Active: 2015
Title: Kenichi Hinuma: Innovator in Wafer Bonding Technology
Introduction: Kenichi Hinuma is a prominent inventor based in Kyoto, Japan. He is known for his significant contributions to the field of wafer bonding technology. His innovative methods have paved the way for advancements in semiconductor manufacturing.
Latest Patents: Kenichi Hinuma holds a patent for a method for bonding wafers and the structure of the bonding part. This method involves forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer made of a material with low wettability to AuSn. The bonding layer is then formed on the diffusion preventing layer, ensuring it stays back from the edge of the diffusion preventing layer. A second bonding part is created on a second wafer, and the two bonding parts are joined through eutectic bonding using AuSn solder under specific conditions.
Career Highlights: Kenichi Hinuma has made a remarkable impact in his field through his work at Omron Corporation. His expertise in wafer bonding has been instrumental in enhancing the efficiency and reliability of semiconductor devices.
Collaborations: Kenichi has collaborated with notable colleagues, including Takeshi Fujiwara and Toshiaki Okuno. Their combined efforts have contributed to the advancement of technology in their respective areas.
Conclusion: Kenichi Hinuma's innovative work in wafer bonding technology exemplifies the importance of creativity and collaboration in the field of semiconductor manufacturing. His contributions continue to influence the industry positively.