Sayama, Japan

Kengo Shibusawa

This inventor holds 1 USPTO granted patent. Top assignee: Honda Giken Kogyo Kabushiki Kaisha. Active years: 1992.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kengo Shibusawa. Retrieved from https://idiyas.com/inventor/kengo-shibusawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 1992

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1 patent (USPTO):Explore Patents

Title: Kengo Shibusawa and Automotive Body Assembly Innovation.

Introduction

Kengo Shibusawa is an inventor associated with Honda Giken Kogyo Kabushiki Kaisha. Based in Sayama, Japan, he is credited with 1 patent concerning automotive body assembly and coating processes.

Latest Patents

Shibusawa’s listed patent, “Method of Assembling Automotive Body and Body Panels, Apparatus for,” describes a process for assembling and coating an automotive body and removable panels, including the hood, trunk lid, and doors. Along the first feed path, panels are removed from the body and mounted on a feed jig, allowing the body and panels to be coated separately. They then travel along a second feed path, where the panels are removed from the jig and reinstalled on the body. The jig uses the same fasteners used to attach the panels to the automotive body.

Career Highlights

The patent addresses the coordination of body panels and automotive bodies through assembly and coating stages. Its feed-jig approach is designed to support the handling of removable panels throughout the production process.

Collaborations

Shogo Ozawa and Tadashi Takeo are identified as Shibusawa’s coworkers. The available information does not specify their roles in the patent or the invention.

Conclusion

Kengo Shibusawa’s listed patent focuses on a practical production method for handling, coating, and reassembling automotive bodies and their panels.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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