Keng-Tuan Chang

Title: Keng-Tuan Chang: Innovator in Semiconductor Packaging

Introduction

Keng-Tuan Chang is a prominent inventor based in Kaohsiung, Taiwan. With a total of two patents to his name, he has made significant contributions to the field of semiconductor technology. His work demonstrates a commitment to innovation and excellence in engineering.

Latest Patents

One of Keng-Tuan Chang's latest patents focuses on a semiconductor package structure and a method for manufacturing the same. This invention outlines a novel process that includes providing a package body that comprises a first semiconductor device. The device features a number of first electrical contacts positioned adjacent to its active surface. The method advances further by measuring the actual positions of these electrical contacts, followed by the inclusion of second electrical contacts outside the first semiconductor device. Ultimately, an interconnection structure is formed, ensuring that the connections between the first and second electrical contacts maintain signal integrity during transmission through a mask-less process. This invention showcases Chang's dedication to enhancing the performance of semiconductor packaging.

Career Highlights

Keng-Tuan Chang has been associated with Advanced Semiconductor Engineering, Inc., where he applies his expertise in semiconductor technology. His role in this leading company contributes to their overall capacity to innovate within the semiconductor industry, thereby solidifying their position in the market.

Collaborations

Throughout his career, Keng-Tuan has collaborated with notable colleagues such as Chen-Chao Wang and Chih-Yi Huang. These collaborations highlight his engagement with other skilled professionals in the field, fostering an environment of shared knowledge and innovation.

Conclusion

Keng-Tuan Chang continues to be an influential figure in the semiconductor industry. With a strong foundation in patent innovation, his work not only drives advancements in technology but also sets the stage for future developments in semiconductor packaging. As he progresses in his career at Advanced Semiconductor Engineering, Inc., we can expect to see even more groundbreaking contributions from this accomplished inventor.