Keng Hung Lin

This inventor holds 13 USPTO granted patents and 5 published patent applications and 1 EPO patent. Top assignees: Adventive Ipbank, Advanced Analogic Technologies Incorporated, Applied Biophotonics Ltd.. Active years: 2013-2022.

USPTO Granted Patents = 13 (Patent Applications = 5)

% Patents Active = 84.6

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 2.3

ph-index = 5

Forward Citations = 91(Granted Patents)

Location History:

Kaohsiung, TW (2013 - 2016)
Chupei, TW (2017 - 2022)

Company Filing History:

Advanced Analogic Technologies Incorporated

patents

3 out of 8

Applied Biophotonics Ltd.

patents

4. 1 out of 55

Advanced Analogic Technologies (Hong Kong) Limited

patents

5. 1 out of 1

Adventive International Ltd.

patent

6. 1 out of 4

Skyworks Solutions (Hong Kong) Limited

patents

where one patent can have more than one assignee

Years Active: 2013-2022

Loading Chart...

13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11469205 - Universal surface-mount semiconductor package (2022-10-11),

2. 11184981 - Method of supplying electrical power from rigid printed circuit board to another rigid printed circuit board in rigid-flex printed circuit board array (2021-11-23),

3. 11109458 - Phototherapy system with dynamic drive for light-emitting diodes (2021-08-31),

4. 10328276 - Sinusoidal drive system and method for phototherapy (2019-06-25),

5. 10312111 - Method of fabricating low-profile footed power package (2019-06-04),

6. 10064276 - 3D bendable printed circuit board with redundant interconnections (2018-08-28),

7. 10032649 - Method of fabricating low-profile footed power package (2018-07-24),

8. 9895550 - Flexible LED light pad for phototherapy (2018-02-20),

9. 9620439 - Low-profile footed power package (2017-04-11),

10. 9576932 - Universal surface-mount semiconductor package (2017-02-21),

11. 9305859 - Integrated circuit die with low thermal resistance (2016-04-05),

12. 8778740 - Process for fabricating multi-die semiconductor package with one or more embedded die pads (2014-07-15),

13. 8513787 - Multi-die semiconductor package with one or more embedded die pads (2013-08-20),

Title: Inventor Keng Hung Lin: Revolutionizing Technology in Chupei

Introduction: Keng Hung Lin is a visionary inventor hailing from Chupei, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Keng Hung Lin holds several patents in the areas of artificial intelligence, renewable energy, and nanotechnology, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Keng Hung Lin has worked with leading tech companies, research institutions, and universities, driving forward cutting-edge projects and pushing the boundaries of technological advancement.

Collaborations: Throughout his career, Keng Hung Lin has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge exchange that has led to the development of pioneering technologies.

Conclusion: Keng Hung Lin's relentless pursuit of innovation and his passion for creating a better future through technology make him a true trailblazer in the world of inventions.