Milpitas, CA, United States of America

Ken Wang

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.5

ph-index = 2

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2015-2017

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3 patents (USPTO):Explore Patents

Title: Ken Wang: Innovator in Semiconductor Packaging Technologies

Introduction

Ken Wang, an accomplished inventor based in Milpitas, California, has made significant strides in the field of semiconductor packaging technologies. With three patents to his name, Wang's innovative contributions are shaping the future of sensor applications in various electronic devices.

Latest Patents

Wang's latest patents include a groundbreaking invention titled "Hermetic solution for thermal and optical sensor-in-package." This patent describes a sensor-in-package device and outlines a process for fabricating this hermetically-sealed device. The innovation features a substrate with integrated components such as a thermopile, photodetector, light-emitting diode, and an ultraviolet light sensor, all encapsulated within a pre-assembled hat structure. This design not only protects sensitive components but enhances their performance in thermal and optical applications.

Another notable patent is the "Silicon shield for package stress-sensitive devices," which introduces a surface mount semiconductor package designed to mitigate packaging stress on integrated circuit devices. This invention employs a leadframe assembly, a silicon shield, and a molding layer, ensuring the reliability and longevity of semiconductor devices in various environments.

Career Highlights

Ken Wang is currently affiliated with Maxim Integrated Products, Inc., a leader in analog and mixed-signal semiconductor solutions. Throughout his career, he has focused on developing innovative solutions that enhance the performance and stability of electronic devices. His technical expertise has positioned him as a key player in the semiconductor industry.

Collaborations

At Maxim Integrated Products, Wang collaborates with talented professionals, including colleagues Seshasayee Gaddamraja and Tian Tian. These partnerships foster an environment of creativity and innovation, enabling the team to push the boundaries of semiconductor packaging technologies.

Conclusion

Ken Wang's innovative spirit and technical acumen have led to significant advancements in semiconductor packaging. With his latest patents, he continues to contribute to the evolution of sensor technologies, ensuring that devices are not only effective but also reliable in their applications. As technology progresses, Wang's work remains a testament to the importance of innovation in the fast-paced world of electronics.

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