Toyko, Japan

Ken Ukawa

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Tochigi, JP (2010)
  • Tokyo, JP (2010)
  • Toyko, JP (2015)

Company Filing History:


Years Active: 2010-2015

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3 patents (USPTO):Explore Patents

Title: Ken Ukawa: Innovator in Resin Composition and Semiconductor Technology

Introduction

Ken Ukawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of resin compositions and semiconductor devices. With a total of 3 patents to his name, Ukawa's work is recognized for its innovative approaches to encapsulating electronic components.

Latest Patents

Ukawa's latest patents include a resin composition for encapsulation and an electronic device utilizing this composition. This invention provides a resin composition that contains a phenol resin curing agent and an epoxy resin, where either component features a biphenyl structure. Additionally, the resin composition ensures that the cured material has a glass transition temperature of 200°C or higher, with a weight reduction rate of 0.3% or lower. Another notable patent is an epoxy resin composition designed for encapsulating semiconductors, which boasts high flame resistance without the use of flame retardants and excellent solder reflow resistance.

Career Highlights

Ken Ukawa is currently employed at Sumitomo Bakelite Company Limited, where he continues to innovate in the field of materials science. His work has been instrumental in advancing the technology used in electronic devices and semiconductor applications.

Collaborations

Ukawa has collaborated with notable colleagues such as Kazuyoshi Murotani and Kenji Yoshida, contributing to the development of cutting-edge technologies in their field.

Conclusion

Ken Ukawa's contributions to resin compositions and semiconductor technology highlight his role as a key innovator in the industry. His patents reflect a commitment to advancing electronic component encapsulation methods, ensuring enhanced performance and reliability.

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