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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9136194 B1

PDFFull Text
Expired
Date of Patent:
Sep. 15, 2015

Filed:

Feb. 26, 2013

Resin composition for encapsulation and electronic device using the same

Applicant:

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Inventors:

Kenji Yoshida, Tokyo, JP;

Ken Ukawa, Toyko, JP;

Yusuke Tanaka, Tokyo, JP;

Assignee:

SUMITOMO BAKELITE CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Robert Jones, Jr

Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08G 59/62 (2006.01); C09D 163/00 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08G 59/24 (2013.01); C08G 59/3218 (2013.01); C08G 59/621 (2013.01); C08L 63/00 (2013.01); C09D 163/00 (2013.01); H01L 23/3107 (2013.01); H01L 24/45 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/10253 (2013.01);
Abstract

The present invention provides a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which either the phenol resin curing agent or the epoxy resin has a biphenyl structure; a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which a glass transition temperature of a cured material is equal to or higher than 200° C., and a weight reduction rate of the cured material is equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition.

Find Patent Forward Citations

Yoshida, Kenji. (2015). Resin composition for encapsulation and electronic device using the same (U.S. Patent No. 9136194). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9136194

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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