The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Feb. 26, 2013
Applicant:
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SUMITOMO BAKELITE CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08G 59/62 (2006.01); C09D 163/00 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08G 59/24 (2013.01); C08G 59/3218 (2013.01); C08G 59/621 (2013.01); C08L 63/00 (2013.01); C09D 163/00 (2013.01); H01L 23/3107 (2013.01); H01L 24/45 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/10253 (2013.01);
Abstract
The present invention provides a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which either the phenol resin curing agent or the epoxy resin has a biphenyl structure; a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which a glass transition temperature of a cured material is equal to or higher than 200° C., and a weight reduction rate of the cured material is equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition.