Mukwonago, WI, United States of America

Ken Phillips

This inventor holds 1 USPTO granted patent. Top assignee: Aptargroup, Inc.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ken Phillips. Retrieved from https://idiyas.com/inventor/ken-phillips-cqwba46o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Ken Phillips - Innovator in Container Closure Technology

Introduction

Ken Phillips is a notable inventor based in Mukwonago, Wisconsin. He has made significant contributions to the field of container closure technology. His innovative designs aim to enhance the functionality and safety of containers used for fluent substances.

Latest Patents

Ken Phillips holds a patent for a closure designed for a fluent substance-containing system. This closure includes a body that receives the fluent substance, an actuator that controls the flow, and a shell that encases the closure body. The design features a blocking member that can transition between two configurations, allowing for controlled dispensing of the substance.

Career Highlights

Ken Phillips is currently employed at Aptargroup, Inc., where he continues to develop innovative solutions in packaging technology. His work focuses on creating closures that improve user experience and product safety.

Collaborations

Throughout his career, Ken has collaborated with talented individuals such as Curt Prusko and Kay Stanish. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.

Conclusion

Ken Phillips is a dedicated inventor whose work in container closure technology has made a significant impact. His innovative designs and collaborations continue to shape the industry, ensuring safer and more efficient packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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