Company Filing History:
Years Active: 2000-2001
Title: Ken Gilleo: Innovator in Flip Chip Technology
Introduction
Ken Gilleo is a notable inventor based in Chepachet, Rhode Island, with a focus on advancements in electronic manufacturing. He holds three patents that showcase his innovative contributions to the field of flip chip technology and adhesive systems.
Latest Patents
One of his latest patents is for a flip chip with integrated flux and underfill. This invention features solder bumps, an integrated underfill, and a separate flux coating, along with methods for creating such a device. The design simplifies the manufacturing process by allowing a one-step application to a printed circuit board, eliminating the need for a separate underfilling step. Another significant patent is for a snap cure adhesive based on anhydride/epoxy resins. This invention introduces a two-stage accelerator for filled anhydride/epoxy systems, utilizing a first accelerator to initiate curing while the filler is wetted, followed by a second, faster accelerator to complete the curing process.
Career Highlights
Throughout his career, Ken Gilleo has worked with prominent companies in the electronics industry, including Alpha Metals, Inc. and Fry's Metals, Inc. His experience in these organizations has contributed to his expertise in developing innovative solutions for electronic manufacturing challenges.
Collaborations
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Conclusion
Ken Gilleo's contributions to flip chip technology and adhesive systems highlight his role as an influential inventor in the electronics field. His patents reflect a commitment to simplifying manufacturing processes and enhancing product performance.