Alpha Metals, Inc.

Fry's Metals, Inc.

Ken Gilleo

A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.

Flip chip with integrated flux and underfill

A two-stage accelerator for use in filled anhydride/epoxy systems is disclosed. In particular, the present invention makes use of a first accelerator to initiate curing of the epoxy while the filler becomes wetted, and a second, faster accelerator to complete the curing process.

Snap cure adhesive based on anhydride/epoxy resins

An indicator for complete polymerization and cure of base-catalyzed epoxy thermoset resin systems is disclosed. In particular, the present invention makes use of an diazo dye having amino groups which forms a salt or complex with hardeners used in various epoxy resin systems. Upon full polymerization and consumption of the hardener, a chromophoric shift of the dye can be observed.

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Chepachet, RI, United States of America

Ken Gilleo