This inventor holds 1 USPTO granted patent. Top assignee: National Semiconductor Corporation. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Ken Fei Lim: Innovator in Semiconductor Technology
Introduction
Ken Fei Lim is a notable inventor based in Taman Rasah Jaya, Malaysia. He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods and apparatuses.
Latest Patents
Ken Fei Lim holds a patent for a "Method and apparatus for dicing die attach film on a semiconductor wafer." This invention describes a method of sawing a semiconductor wafer, where the wafer is positioned in a sawing apparatus that includes a sawing blade and a movable support structure. The semiconductor wafer is coupled with the support structure through various layers, including a die attach film, adhesive, and base film. The sawing blade cuts through the die attach film while the support structure moves in the opposite direction, enhancing the efficiency of the sawing process.
Career Highlights
Ken Fei Lim is associated with National Semiconductor Corporation, where he has applied his expertise in semiconductor technology. His work has contributed to advancements in the manufacturing processes of semiconductor devices.
Collaborations
He has collaborated with notable coworkers, including You Chye How and Kooi Choon Ooi, who have also contributed to the field of semiconductor technology.
Conclusion
Ken Fei Lim's innovative work in semiconductor technology, particularly his patented methods, showcases his significant impact on the industry. His contributions continue to influence advancements in semiconductor manufacturing processes.