Ken Chen

Title: Innovations of Ken Chen in Semiconductor Packaging

Introduction

Ken Chen is an innovative inventor based in Hsinchu, China, who has made significant contributions to the field of semiconductor packaging. He holds a patent that enhances the capabilities of wafer level chip scale packaging, a method that is crucial for the miniaturization of electronic devices.

Latest Patents

Ken's notable patent is entitled "Method of Wafer Level Chip Scale Packaging." This invention details a sophisticated method involving several key components. It encompasses providing a semiconductor device that has a silicon-based substrate with discrete devices defined within, coupled with a contact pad located near the upper surface. The invention further describes a passivation layer over the silicon substrate and contact pad, featuring an opening that exposes a portion of the contact pad. A redistribution trace is electrically connected to the contact pad, leading to an encapsulation layer that covers the semiconductor device. The process also describes forming a contact post within the encapsulation layer which maintains electrical connectivity, thereby enhancing functionality and performance in semiconductor applications.

Career Highlights

Ken Chen is currently employed at Taiwan Semiconductor Manufacturing Company (TSMC), recognized as a global leader in semiconductor manufacturing. His work focuses on cutting-edge technologies that propel the industry forward. With a strong foundation in semiconductor innovations, Ken's contributions have been pivotal in advancing packaging techniques that are integral to modern electronics.

Collaborations

Throughout his career, Ken Chen has collaborated with fellow professionals in the industry, including Chender Huang and Pei-Haw Tsao. These collaborations aim to foster innovation and tackle complex challenges in semiconductor technology, enhancing the overall effectiveness and efficiency of their projects.

Conclusion

Ken Chen stands out as a key figure in the realm of semiconductor innovations with his patent for wafer level chip scale packaging. His continuous efforts at Taiwan Semiconductor Manufacturing Company, along with his collaborative work with peers, demonstrate his commitment to advancing technology. Ken's contributions not only enhance the capabilities of electronic devices but also set new standards in semiconductor manufacturing practices.