Mesa, AZ, United States of America

Ken Brice-Heames


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: **Ken Brice-Heames: Innovating High-Frequency Circuit Protection**

Introduction

Ken Brice-Heames is an accomplished inventor located in Mesa, AZ, who has made significant contributions to the field of high-frequency electronics. With a focus on the development and protection of high-frequency circuits, he holds a patent that showcases his innovative solutions in this niche.

Latest Patents

His notable patent, titled "High Frequency Gallium Arsenide MMIC Die Coating Method," provides a moisture-resistant conformal coating that effectively protects high-frequency circuits such as gallium arsenide MMICs from humidity and environmental contamination. This novel approach addresses the limitations of conventionally applied conformal coatings, which often result in performance degradation. The coating comprises an organic polymer, like silicone, applied in a uniform thickness of less than 0.002 inches, aiming for optimal protection without compromising performance.

Career Highlights

Ken Brice-Heames works at Motorola Corporation, where he leverages his expertise in materials science and engineering to drive advancements in technology. His work at Motorola not only emphasizes innovation but also enhances the reliability of electronic devices used in various industry applications.

Collaborations

Throughout his career, Ken has collaborated with notable colleagues, including James F. Landers and Ronald Dee Fuller. These partnerships have further enriched his work and have contributed to the successful development of technologies aimed at improving circuit performance and durability.

Conclusion

Ken Brice-Heames continues to be a significant figure in the landscape of high-frequency circuit technology. His dedication to innovation and collaboration with fellow engineers has resulted in impactful advancements, ensuring the reliability of electronic components for various applications. Through his work, he exemplifies the spirit of innovation, proving that thoughtful engineering solutions can lead to groundbreaking improvements in technology.

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