Keji Horioka

Title: Keji Horioka: Innovator in Plasma Etching Technology

Introduction

Keji Horioka is a notable inventor based in Mihama, Japan. He has made significant contributions to the field of plasma etching technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and effectiveness of oxide etching processes.

Latest Patents

Horioka's latest patents include innovative methods for magnetically enhanced plasma oxide etching. One of his patents describes a process that utilizes hexafluorobutadiene as an etching gas in a magnetically enhanced reactive ion etch (MERIE) reactor. This process involves maintaining a magnetic field above 50 gauss and operating at a pressure of 40 milliTorr or higher, with chamber residence times of less than 70 milliseconds. A two-step process is employed for etching holes with very high aspect ratios, where the magnetic field and oxygen flow are reduced in the second step. Additionally, he has developed a similar process using a heavy fluorocarbon etching gas, which also includes equal amounts of a hydrogen-free fluorocarbon and oxygen, along with a larger amount of argon diluent gas.

Career Highlights

Keji Horioka is currently associated with Applied Materials, Inc., a leading company in the semiconductor and display industries. His work has been instrumental in advancing plasma etching techniques, which are crucial for the fabrication of microelectronic devices.

Collaborations

Horioka has collaborated with notable colleagues in his field, including Jingbao Liu and Takehiko Komatsu. Their combined expertise has contributed to the development of innovative etching processes that enhance manufacturing capabilities.

Conclusion

Keji Horioka's contributions to plasma etching technology have established him as a key figure in the field. His innovative patents and collaborations continue to influence advancements in semiconductor manufacturing.