Keith P Brodock

Title: Innovator Keith P Brodock: Pioneering Technologies in Printed Wiring Boards

Introduction

Keith P Brodock, based in Endwell, NY, is a noteworthy inventor with a focus on advancements in printed wiring board technology. With three patents to his name, Brodock has made significant contributions that enhance the capabilities of composite wiring boards.

Latest Patents

Among his latest innovations, Brodock has developed a method for producing a Z-axis interconnection assembly of printed wiring board elements. This patented method involves forming a member that integrates a dielectric substrate with adhesive tape applied to at least one face. Openings are created through the substrate and adhesive tape, allowing for the dispensing of electrically conductive material that is partially cured. Upon the removal of the adhesive tape, a nub of the conductive material is allowed to extend above the substrate face, facilitating the formation of a wiring structure that can connect with other elements. This inventive approach exemplifies his dedication to improving the performance and utility of printed wiring boards.

Career Highlights

Keith P Brodock currently works with International Business Machines Corporation (IBM), a distinguished company known for its cutting-edge technology and innovations. His work at IBM has provided him with the platform to transform his innovative ideas into practical applications that contribute to the company's success in the tech industry.

Collaborations

Throughout his career, Brodock has collaborated with notable colleagues such as Brian Eugene Curcio and Donald Seton Farquhar, indicating a robust network of inventors and professionals in the field. These collaborations have allowed for the cross-pollination of ideas, further enriching the innovation landscape surrounding printed wiring boards.

Conclusion

In conclusion, Keith P Brodock’s pioneering work in the field of printed wiring technology and his collaborations with prominent professionals highlight his status as a significant contributor to the industry. His patented methods not only push the boundaries of current technology but also pave the way for future advancements in wiring board applications.