Westwood, IA, United States of America

Keith C Koch

This inventor holds 1 USPTO granted patent. Top assignee: Metromail Corporation. Active years: 1985.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keith C Koch. Retrieved from https://idiyas.com/inventor/keith-c-koch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 1985

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1 patent (USPTO):Explore Patents

Title: Keith C. Koch: Innovator in Packaging Technology

Introduction

Keith C. Koch is a notable inventor based in Westwood, Iowa, who has made significant contributions to the field of packaging technology. With a focus on innovative solutions, he has developed a unique patent that enhances the efficiency of packaging processes. His work is particularly relevant in today's fast-paced manufacturing environment.

Latest Patents

Keith C. Koch holds a patent for a "Package forming web folder." This invention involves a travelling web made of packaging film that is folded around collated sheets of material. The folding occurs in response to a reversal in the travel direction of the web, utilizing an arrangement of three guide edge segments. Two of these segments, positioned on either side of an intermediate guide edge segment, form parts of two triangular folding guide members. This design allows the web to be folded into transversely overlapping portions, effectively managing the packaging process.

Career Highlights

Throughout his career, Keith has been associated with Metromail Corporation, where he has applied his expertise in packaging technology. His role at the company has allowed him to contribute to advancements in the industry, particularly through his innovative patent.

Collaborations

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Conclusion

Keith C. Koch's contributions to packaging technology through his innovative patent demonstrate his commitment to improving manufacturing processes. His work continues to influence the industry and showcases the importance of innovation in packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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