Lansdale, PA, United States of America

Keith Allen Alderfer

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Rohm and Haas Company. Active years: 2010.


% Patents Active = 100.0


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Keith Allen Alderfer: Innovator in Polymer Composition

Introduction

Keith Allen Alderfer is a notable inventor based in Lansdale, PA (US). He has made significant contributions to the field of polymer science, particularly with his innovative patent related to polymer compositions. His work has implications for various applications, showcasing the importance of advancements in material science.

Latest Patents

Alderfer holds a patent for a polymer composition that includes polymer particles comprising a first polymer and a second polymer. The first polymer may have a crosslinked core and a glass transition temperature ranging from -30°C to 100°C. The second polymer, which contains select crosslinking groups, has a glass transition temperature between -10°C and less than 18°C. This composition is designed to provide good low-temperature film formation and results in a film with an acceptable level of hardness. He has 1 patent to his name.

Career Highlights

Keith Alderfer has been associated with Rohm and Haas Company, where he has applied his expertise in polymer chemistry. His work has contributed to the development of advanced materials that meet industry standards and requirements.

Collaborations

Alderfer has collaborated with notable colleagues, including Gary William Dombrowski and John Charles Halligan. These partnerships have fostered innovation and have been instrumental in the success of various projects.

Conclusion

Keith Allen Alderfer's contributions to polymer science through his patent demonstrate his commitment to innovation in material development. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
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